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you don't have to be an electrical engineer to see that this is revolutionary
| Drab Forum Ceo | 10/09/25 |
| Thriller disrespectful electric furnace dopamine | 10/09/25 |
| Drab Forum Ceo | 10/09/25 |
| Drab Forum Ceo | 10/09/25 |
Poast new message in this thread
Date: October 9th, 2025 7:22 PM Author: Drab Forum Ceo Imagine if you had to sit INSIDE the car engine in every car that was made, and now for the first time you can get a car with the engine in a separate compartment, in back
https://www.techpowerup.com/review/intel-panther-lake-technical-deep-dive/images/opening-keynote-48.jpg |
Date: October 9th, 2025 7:42 PM Author: Thriller disrespectful electric furnace dopamine Isn’t this like that one google phone where you could upgrade the battery or screen if you wanted? (http://www.autoadmit.com/thread.php?thread_id=5784856&forum_id=2\u0026show=month#49338048) |
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Date: October 9th, 2025 10:38 PM Author: Drab Forum Ceo Not really. This solves all kinds of practical engineering problems that arise when you are sending high voltage currents alongside transistors trying to compute. The high voltage current can cause all kinds of interference with the channels carrying signals between transistors. Intel moved all of the power delivery to a separate layer on chip, on the ass end. No more interference as we know it. (http://www.autoadmit.com/thread.php?thread_id=5784856&forum_id=2\u0026show=month#49338418) |
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Date: October 9th, 2025 10:43 PM Author: Drab Forum Ceo Good write-up here. I don't think AI wrote this
"As for PowerVia, the TL;DR version of the tech is that it involves delivering power through the back side of the die. Power and signal lines have different requirements, and putting the power lines on the backside, to bring power from below, through the package to the transistors, allows for the signal lines to be more spread out. Backside power also reduces power loss from the package." |